Laser Depaneling Malaysia

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Laser Depaneling Malaysia (2)

Laser Cutting Malaysia (2)

Laser Cutting Machine Malaysia (2)

Single Platform PCB Laser Cutting Machine

Machine Specification Machine Name Single Platform PCB Laser Cutting Machine Laser 20W UV Laser Wavelength 355nm Cutting Format 350mm×350mm Platform Single Work Table Application Objects LCP, MPI, PI, FR4, FR5, CEM, Polyester, Ceramic and other RF

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Double Platform High Precision Laser Cutting System

Machine Specification Machine Name Double Platform High Precision Laser Cutting System Laser 20W UV Laser Wavelength 355nm Cutting Platform 350mm×500mm Platform Double Platform Application Objects LCP, MPI, PI, FR4, FR5, CEM, Polyester, Ceramic and other RF

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SYMTRACE MASCHINEN SDN BHD

A Proudly Malaysian Specialist in Industrial Laser Technology, we combine global expertise with dedicated local support, empowering local manufacturers to enhance productivity & efficiency through advanced laser solutions.

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